会议信息
DFT 2024: International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems
https://www.dfts.org/截稿日期: |
2024-04-26 |
通知日期: |
2024-07-08 |
会议日期: |
2024-10-08 |
会议地点: |
Oxfordshire, UK |
届数: |
37 |
QUALIS: b1 浏览: 12702 关注: 1 参加: 1
征稿
DFT is an annual Symposium providing an open forum for presentations in the field of defect and fault tolerance in VLSI and nanotechnology systems inclusive of emerging technologies, RISC-V architectures and AI-based solutions. One of the unique features of this symposium is to combine new academic research with state-of-the-art industrial data, necessary ingredients for significant advances in this field. All aspects of design, manufacturing, test, reliability, availability, and security that are affected by defects during manufacturing and by faults during system operation are of interest. Topics include (but are not limited to) the following: 1. Yield Analysis and Modeling Defect/fault analysis and models; statistical yield modeling; diagnosis; critical area and other metrics. 2. Testing Techniques Built-in self-test; delay fault modeling and diagnosis; testing for analog and mixed circuits; online testing; signal and clock integrity. 3. Design For Testability in IC Design FPGA, SoC, NoC, ASIC, low power design and micro-processors, including RISC-V architectures 4. Error Detection, Correction, and Recovery Self-testing and self-checking solutions; error-control coding; fault masking and avoidance; recovery schemes, space/time redundancy; hw/sw techniques; architectural and system-level techniques. 5. Dependability Analysis and Validation Fault injection techniques and frameworks; dependability and characterization, cross-layer reliability analysis, dependability analysis for AI and machine learning. 6. Repair, Restructuring and Reconfiguration Repairable logic; reconfigurable circuit design; DFT for on-line operation; self-healing; reliable FPGA-based systems. 7. Defect and Fault Tolerance Reliable circuit/system synthesis; fault tolerant processes and design; design space exploration for dependable systems, transient/soft faults. 8. Radiation effects SEEs on nanotechnologies; modeling of radiation environments; radiation experiments; radiation hardening techniques. 9. Aging and Lifetime Reliability Aging characterization and modeling; design and run-time reliability, thermal, and variability management and recovery. 10. Dependable Applications and Case Studies Methodologies and case studies: 2.5D/3D ICs, IoT, automotive/railway/avionics/space, autonomous systems, industrial control, fail-safe systems, dependable AI. 11. Emerging Technologies Error management techniques for quantum computing, memristors, spintronics, microfluidics, approximate computing, etc. 12. Design for Security Fault attacks, fault tolerancebased countermeasures, scan-based attacks and countermeasures, hardware trojans, system obfuscation and logic locking, secure AI, security vs. reliability, interaction between VLSI test, trust, and reliability.
最后更新 Dou Sun 在 2024-03-28
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相关期刊
CCF | 全称 | 影响因子 | 出版商 | ISSN |
---|---|---|---|---|
c | Distributed Computing | 1.300 | Springer | 0178-2770 |
Journal of Electronic Testing | 1.100 | Springer | 0923-8174 | |
Photonic Network Communications | 1.800 | Springer | 1387-974X | |
c | Peer-to-Peer Networking and Applications | 3.300 | Springer | 1936-6442 |
c | Journal of Global Information Technology Management | 3.000 | Taylor & Francis | 1097-198X |
IEEE Communications Letters | 3.700 | IEEE | 1089-7798 | |
ReCALL | 4.500 | Cambridge University Press | 0958-3440 | |
Journal of Manufacturing Processes | 6.100 | Elsevier | 1526-6125 | |
Life | 3.200 | MDPI | 2075-1729 | |
Information Systems Frontiers | 6.900 | Springer | 1387-3326 |
全称 | 影响因子 | 出版商 |
---|---|---|
Distributed Computing | 1.300 | Springer |
Journal of Electronic Testing | 1.100 | Springer |
Photonic Network Communications | 1.800 | Springer |
Peer-to-Peer Networking and Applications | 3.300 | Springer |
Journal of Global Information Technology Management | 3.000 | Taylor & Francis |
IEEE Communications Letters | 3.700 | IEEE |
ReCALL | 4.500 | Cambridge University Press |
Journal of Manufacturing Processes | 6.100 | Elsevier |
Life | 3.200 | MDPI |
Information Systems Frontiers | 6.900 | Springer |
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