会议信息
SPLC 2022: International Systems and Software Product Line Conference
http://2022.splc.net/截稿日期: |
2022-04-08 |
通知日期: |
2022-06-02 |
会议日期: |
2022-09-12 |
会议地点: |
Graz, Austria |
届数: |
26 |
浏览: 10134 关注: 3 参加: 1
征稿
Context The International Systems and Software Product Lines Conference (SPLC) is the leading conference on variability and configuration of hardware and software systems. Researchers, practitioners, and educators present and discuss the most recent research breakthroughs, ideas, trends, experiences, challenges and solutions to advance the state-of-the-art. SPLC is ranked as a top conference and for this 26th edition, we strive to continue the success of previous years by welcoming high-quality submissions for the research track. SPLC started 26 years ago with a focus on software product lines, but by now it has become a main event for numerous closely related areas, such as configurable systems, product configuration, and software variability. We are negotiating a special issue with a top-tier journal. In addition, each accepted full paper of the research track is considered for the Best Research Paper Award, and the authors are encouraged to submit an extended version of their paper to the special issue. The Best Student Research Paper Award is reserved for papers with a PhD student as the main author. Topics The following is a list of topics of interest to SPLC, but we also invite submissions to related topics. If in doubt, feel free to ask the track chairs (see below). AI: genetic algorithms, neural networks, and machine learning for product lines Architecture, design, and visualization of product lines Dynamic software product lines, reconfigurable systems, (self-)adaptive systems Evolution, maintenance, and continuous integration for product lines (e.g., DevOps) Formal methods and SPL verification techniques (e.g., program analysis, model checking) Green and sustainable technologies for variation Human, organizational and social aspects of product lines (e.g., BPM, collaborative modeling and development, cooperative configuration processes, economics, program comprehension) Language product lines, and domain-specific and programming languages for product lines Multi product lines, program families, product lines of product lines, software ecosystems Non-functional properties: modeling, analysis, and optimization (e.g., performance, energy) Reverse engineering, variability mining and refactoring (e.g., migration from clone-and-own) Recommender systems for configurators and feature models (e.g., CSP/SAT/SMT solvers) Specification and modeling of SPL (e.g., domain-specific modeling, model-driven engineering) Testing product lines (e.g., product sampling, test-case selection and prioritization, mutations) Variability management and variability modeling (e.g., feature models, decision models)
最后更新 Dou Sun 在 2022-01-28
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相关期刊
CCF | 全称 | 影响因子 | 出版商 | ISSN |
---|---|---|---|---|
IEEE Transactions on Industrial Cyber-Physical Systems | IEEE | 2832-7004 | ||
Polymer | 4.100 | Elsevier | 0032-3861 | |
IEEE Open Journal of the Industrial Electronics Society | 5.200 | IEEE | 2644-1284 | |
c | Journal of Visual Communication and Image Representation | 2.600 | Elsevier | 1047-3203 |
AI EDAM | Cambridge University Press | 0890-0604 | ||
IEEE Open Journal of Circuits and Systems | 2.600 | IEEE | 2644-1225 | |
Scientometrics | 3.500 | Springer | 0138-9130 | |
Computational Management Science | 1.300 | Springer | 1619-697X | |
Information Technology and Management | 2.300 | Springer | 1385-951X | |
b | Journal of Functional Programming | 1.100 | Cambridge University Press | 0956-7968 |
全称 | 影响因子 | 出版商 |
---|---|---|
IEEE Transactions on Industrial Cyber-Physical Systems | IEEE | |
Polymer | 4.100 | Elsevier |
IEEE Open Journal of the Industrial Electronics Society | 5.200 | IEEE |
Journal of Visual Communication and Image Representation | 2.600 | Elsevier |
AI EDAM | Cambridge University Press | |
IEEE Open Journal of Circuits and Systems | 2.600 | IEEE |
Scientometrics | 3.500 | Springer |
Computational Management Science | 1.300 | Springer |
Information Technology and Management | 2.300 | Springer |
Journal of Functional Programming | 1.100 | Cambridge University Press |
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