Conference Information
CFSMS 2021: International Conference on Frontiers of Smart Materials and Structures
http://www.cfsms.org/Submission Date: |
2021-01-25 Extended |
Notification Date: |
2021-02-25 |
Conference Date: |
2021-04-19 |
Location: |
Singapore |
Years: |
2 |
Viewed: 9033 Tracked: 0 Attend: 0
Call For Papers
2021年第二届智能材料与结构国际会议(CFSMS 2021) 重要信息 会议网址:www.cfsms.org 会议时间:2021年4月19-21日 召开地点:新加坡 截稿时间:2021年1月25日 录用通知:投稿后2周内 收录检索:EI,Scopus 会议简介 ★CFSMS 2021将围绕“智能材料与结构”的最新研究领域而展开,来自世界各地的主要研究人员和行业专家将通过论文和口头报告介绍最新研究成果。会议的这三天里,您将有机会聆听到前沿的学术报告,见证该领域的成果与进步。 关于出版和索引 所有接受的论文将在线出版,将被Ei Compendex,SCOPUS,Google Scholar,Cambridge Scientific Abstracts(CSA),Inspec, ISTP等检索,优秀论文将在国际期刊上发表。 特邀主讲人 Seeram Ramakrishna教授——新加坡国立大学,新加坡 Jang-Kyo KIM教授——香港科技大学,香港 Shaowei Chen教授——加利福尼亚大学,美国 Serge COSNIER博士——格勒诺布尔阿尔卑斯大学,法国 征稿主题/会议征稿 先进铸造工艺 市场需求与价值 高级表征技术 基于质量和尖端的传感器 高级计算机辅助绘图 材料挑战 更多征稿主题请访问:http://www.cfsms.org/cfp 参会方式 1.作者参会:一篇会议录用文章允许一名作者参会; 2.主讲嘉宾:申请主题演讲,由会务组审核; 3.口头演讲:申请口头报告,时间为15分钟; 4.海报参会:申请海报参会,根据官网模板准备海报,再录制5分钟视频; 5.视频参会:录制个人视频15分钟即可; 6.听众参会:不投稿仅参会,可参与问答,也可演讲及展示。 投稿方式 1.会议邮箱:cfsms@iased.org 2.CMT在线投稿:https://cmt3.research.microsoft.com/CFSMS2021 请作者按照官网模板格式进行排版。排版好的论文全文(word+pdf版)发送至CMT在线系统或者会议邮箱。 投稿注意事项: 1. 大会官方语言为英语,必须为全英文稿件; 2. 保证文章原创性,未在国内外公开刊物或其它学术会议上发表过。 3. 文章篇幅一般在5-12页之间,不少于5页,超过6页将收取超页费; 4. 请按照官网上模板的格式编排。审稿周期约为3-7个工作日; 5. 稿件不允许有剽窃行为,涉嫌抄袭的文章将不会送审。 6. 提交摘要:即只参会做报告,不出版文章; 提交全文:即做参会做报告,并且出版文章; 听众:则不需要提交稿件,注册成功的听众可以参加会议的所有分会; 联系我们 会议秘书:黄女士 会议官网:www.cfsms.org 会议邮箱:cfsms@iased.org 微信ID:IntlConfConsult QQ咨询:2011307354
Last updated by Wind Zeng in 2020-12-23
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