Conference Information
ICMTIM 2022: International Conference on Mechatronics Technology and Intelligent Manufacturing
http://www.icmtim.org/Submission Date: |
2022-04-02 |
Notification Date: |
2022-04-09 |
Conference Date: |
2022-04-15 |
Location: |
Hangzhou, China |
Years: |
3 |
Viewed: 3100 Tracked: 0 Attend: 1
Call For Papers
The 3rd International Conference on Mechatronics Technology and Intelligent Manufacturing (ICMTIM 2022) will bring together leading researchers, engineers and scientists in the domain of interest from around the world. Topics of interest for submission include, but are not limited to: Mechatronics Technology Mechatronics Control Sensors and Actuators 3D Printing Technologies Intelligent control Motion Control Opto-Electronic Systems Optomechatronics Humanoid Robots Human-Machine Interfaces Advanced Motion Control Integrated Manufacturing System Vibration and Noise Control Smart Materials and Structures Precision Measurement Technology Micro/Nano-Manufacturing and MEMS/NEMS Artificial Intelligence and Intelligent Control Fault detection and diagnosis in mechatronics systems Industrial Robots and Automatic Production Line Advanced Forming Manufacturing and Equipment NEMS/MEMS Technology and Equipment Modeling, analysis and simulation of manufacturing processes High-speed/Precision Machining and Inspection Technology Intelligent Manufacturing Modeling and Design Intelligent Systems Intelligent mechatronics Micro-Machining Technology Sustainable Production Recycling and Remanufacturing Rapid Manufacturing Digital Manufacturing (CAx, CAPP, MES, DES, etc.) Micro-Electronic Packaging Technology and Equipment Theory and Application of Friction and Wear Integrated Manufacturing System Analysis and Decision of Industry & Manufacturing System Digital Manufacture and Management Green Supply Chain System Analysis and Industrial Engineering Manufacturing Systems and Industry Application Modeling, analysis and simulation of manufacturing processes Collaborative and Digital Manufacturing for Advancing Product Quality Other related topic
Last updated by Dou Sun in 2022-03-20
Related Conferences
Short | Full Name | Submission | Conference |
---|---|---|---|
DSML' | International Conference on Data Science and Machine Learning | 2023-10-14 | 2023-10-28 |
ICPE' | International Conference on Power Engineering | 2023-10-30 | 2023-12-11 |
ERMM | International Conference on Education Reform and Modern Management | 2021-04-16 | 2021-04-11 |
EBICC | International Brazilian Meeting on Cognitive Science | 2015-09-30 | 2015-12-07 |
HPBD&IS | International Conference on High Performance Big Data and Intelligent Systems | 2021-10-31 | 2021-12-05 |
BlockSys | International Conference on Blockchain and Trustworthy Systems | 2021-03-20 | 2021-08-05 |
NISS' | International Conference on Networking, Information Systems & Security | 2023-02-26 | 2023-05-24 |
EAME | International Conference on Electrical, Automation and Mechanical Engineering | 2020-07-01 | 2020-11-22 |
STACS | International Symposium on Theoretical Aspects of Computer Science | 2024-09-26 | 2025-03-04 |
IT | International Conference on Information Theory | 2023-02-04 | 2023-02-18 |
Related Journals
CCF | Full Name | Impact Factor | Publisher | ISSN |
---|---|---|---|---|
Applied Sciences | 2.500 | MDPI | 2076-3417 | |
Digital Communications and Networks | 7.500 | Elsevier | 2352-8648 | |
Symmetry | 2.200 | MDPI | 2073-8994 | |
b | ACM Transactions on Mathematical Software | 2.700 | ACM | 0098-3500 |
Engineering Analysis with Boundary Elements | 4.200 | Elsevier | 0955-7997 | |
IEEE Software | 3.300 | IEEE | 0740-7459 | |
b | Computer Supported Cooperative Work | 2.000 | Springer | 0925-9724 |
IEEE Transaction on Affective Computing | IEEE | 1949-3045 |
Full Name | Impact Factor | Publisher |
---|---|---|
Applied Sciences | 2.500 | MDPI |
Digital Communications and Networks | 7.500 | Elsevier |
Symmetry | 2.200 | MDPI |
ACM Transactions on Mathematical Software | 2.700 | ACM |
Engineering Analysis with Boundary Elements | 4.200 | Elsevier |
IEEE Software | 3.300 | IEEE |
Computer Supported Cooperative Work | 2.000 | Springer |
IEEE Transaction on Affective Computing | IEEE |
Recommendation