Conference Information
DIKW 2025: IEEE International Conference on Data, Information, Knowledge and Wisdom
https://hpcn.exeter.ac.uk/dikw2025/Submission Date: |
2025-03-15 |
Notification Date: |
2025-05-01 |
Conference Date: |
2025-06-26 |
Location: |
Exeter, UK |
Years: |
5 |
Viewed: 5495 Tracked: 1 Attend: 1
Call For Papers
Welcome Message Welcome to The 5th IEEE International Conference on Data, Information, Knowledge, and Wisdom (DIKW-2025). Data, Information, Knowledge and Wisdom, in short (DIKW), have been used widely as marking terms in various domains for expressing and exchanging semantic or conceptual subjective or objective understandings. However, there are still no unified understandings over the meaning of the DIKW concepts. Data, Information, Knowledge, and Wisdom as a whole concept of DIKW is also missing unified understandings of the relationships among them. Therefore, there have been proposals and models of DIKW as “layered hierarchy”, “architecture”, “framework”, “network”, “thinking mode”, “pattern”, “style”, “theory”, “methodology”, “model”, “graph”, etc. The 5th IEEE International Conference on Data, Information, Knowledge, and Wisdom (DIKW-2025) will be held on June 26-28, 2025 at Exeter, England , UK, which is co-organized by University of Exeter, aims to bring together scientists, researchers, and industrial engineers to exchange experimental and theoretical Data/Information/Knowledge/Wisdom modeling and processing results, novel designs, explainable AI, AI governance, work-in-progress and case studies on theories, design mechanisms and extensions on DIKW transformations and interactions in all areas, in all phases, empirical or theoretical solutions. We hope you will join us for the great gathering and look forwards to seeing you in the beautiful city Exeter! Prospective authors are invited to submit their papers to DIKW-2025. All accepted papers are expected to be included in IEEE Xplore and will be indexed by Engineering Index (EI). The authors of selected best papers will be invited post conference to extend their contributions for special issues of prestigious journals to be planned in conjunction with the conference. Scope and Topics Topics of interest include, but are not limited to: Theories, Algorithms and Platforms for Data Analytics and Information Retrieving Data Provenance, Cleaning, Curation and Governance Services Data Provenance, Cleaning, Curation and Governance Services Data, Information, Knowledge and Wisdom Sharing, Integration and Migration Real-time Data Modeling and Information Provision Services and Applications Data-driven Intelligent Decision-making and Innovative Applications Goal or Purpose Models, Techniques and Tools for Smart Computing Data Models, Information Semantics, Query languages Data Stream Systems and Sensor Networks Data Visualization and Interactive Data Exploration Hybrid AI Privacy, Security, Trust, and Responsibility Provision Data-Knowledge Mixed Processing Systems and Service Architecture Domain Knowledge Modeling and Ontology-Building Data, Information and Knowledge Transformation Load balance DIKW content Storage and Retrieval and Interface Technology Software Tools for Data-Information-Knowledge Quality Modeling and Testing Computational Intelligence for Data, Information and Knowledge Hybrid Systems Multimedia and Cross-modals "Databases" Processing Development and Management of Heterogeneous Knowledge Bases Knowledge Extraction, Discovery, Analysis and Representation Application of Knowledge Representation Techniques to Semantic Modeling Optimization Techniques of DIKW applications Theories of DIKW Models and Performance Evaluation Approach
Last updated by Dou Sun in 2024-12-18
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Full Name | Impact Factor | Publisher |
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IEEE/ACM Transactions on Networking | 3.000 | IEEE/ACM |
Kybernetes | 2.400 | Emerald |
International Journal of Computer Science, Engineering and Information Technology | AIRCC | |
Materials Chemistry and Physics | 4.300 | Elsevier |
IEEE Pervasive Computing | 1.600 | IEEE |
IEEE Transactions on Cloud Computing | 5.300 | IEEE |
Structural and Multidisciplinary Optimization | 3.600 | Springer |
Interactive Learning Environments | 3.700 | Taylor & Francis |
IEEE Transaction on Affective Computing | IEEE |
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