会议信息
AMLDS 2025: International Conference on Advanced Machine Learning and Data Science
http://amlds.site/
截稿日期:
2025-02-10
通知日期:
2025-03-10
会议日期:
2025-07-19
会议地点:
Tokyo, Japan
浏览: 4047   关注: 0   参加: 0

征稿
Full name: 2025 International Conference on Advanced Machine Learning and Data Science
Abbreviation: AMLDS 2025
Website: www.amlds.site
Date: 19th-21st July 2025
Location: Tokyo, Japan
Sponsors: IEEE Systems, Man, and Cybernetics Society, Chongqing University of Posts and Telecommunications,and Nanjing University

AMLDS 2025 aims to enhance the state-of-the-art in Machine Learning and Data Science, as well as other promising areas of computing, by encouraging fresh, high-quality research discoveries and inventive solutions to tough machine learning challenges. Researchers, academicians, and professionals from all over the world are invited to submit original, unpublished research papers from all perspectives, including theory, practice, experimentation, and review papers highlighting specific research domains for presentation in the conference's technical sessions.


*PROCEEDINGS
-------------------
Accepted and presented papers will be included in IEEE Xplore, and indexed by Ei Compendex, Scopus, etc.


*KEYNOTE SPEAKERS
------------------------
▪Prof.Shyi-Ming Chen, IEEE Fellow, IET Fellow, IFSA Fellow, AAIA Fellow
National Taiwan University of Science and Technology, Taiwan

▪Prof. Loi Lei Lai, IEEE Life Fellow, IET Fellow
DRPT International Incorporated, Australia

▪Prof. Hideyuki TAKAGI, Past Vice-President of the IEEE SMCS
Kyushu University, Japan


*TOPICS
----------
We target contributions from both academia and industrials on the following topics, but not limited to:

▪Machine Learning Foundations
Machine Learning System Design
Machine Learning Optimization
Supervised Learning
Unsupervised Learning
Reinforcement Learning

▪Deep Learning and Data Engineering
Deep Neural Networks Optimization Algorithms
Deep Feedforward Networks
Regularization
Deep Convolutional Neural Networks
Deep Recurrent Neural Networks

▪Machine Learning and Data Engineering
Machine Learning in Data Lakes
Machine Learning based Data Integration and Data Interoperability
Machine Learning Data Pipelines
Machine Learning based Data Streaming
Machine Learning Relating to Knowledge and Data Management

▪Applications
Bioinformatics
Biomedical informatics
Computational Biology
Healthcare
Human Activity Recognition


*SUBMISSION
-----------------
1. Full Paper (Publication and Presentation)
2. Abstract (Presentation only)
Submission link: https://easychair.org/conferences/?conf=amlds2025


*IMPORTANT DATES
------------------------
▪Submission Deadline
10th February 2025

▪Notification Date
10th March 2025

▪Registration Deadline
30th March 2025


*AMLDS 2025 AWARDS
------------------------
▪Outstanding Paper Award
▪Best Student Paper Award
▪Best Oral Presentation Award
▪Best Poster Presentation Award
▪Best Reviewer Award


*ORGANIZING COMMITTEE
--------------------------------
▪Conference Chairs
Rafik Hamza, Tokyo International University
Jun Wu, Waseda University
Ljiljana Trajkovic, Simon Fraser University, Canada
▪Conference Co-chairs
Minh-Son Dao, National Institute of Information and Communications Technology
Do-van Nguyen, National Institute of Information and Communications Technology
Takahiro Komamizu, Nagoya University
MSH Nazmudeen, Universiti Teknologi Brunei
▪Advisory Committee Chairs
KWONG Tak Wu Sam, City University of Hong Kong
Imre J. Rudas, Obuda University
▪International Advisory Committee
Daniele Giusto, University of Cagliari
Gyu Myoung Lee, Liverpool John Moores University
Mamoun Alazab, Charles Darwin University, Australia
Noushath Shaffi, University of Technology and Applied Sciences
Mustafa Misir, Duke Kunshan University
Longzhi Yang, Northumbria University
▪Technical Program Chairs
Witold Pedrycz, University of Alberta
Sos Agaian, The City University of New York
Xiaojie Wang, Chongqing University of Posts and Telecommunications
Wanyang Dai, Nanjing University
Parag Kulkarni, Tokyo International University
Fatih Ozaydin, Tokyo International University
▪Technical Program Co-chairs
Valentina Emilia Balas, Aurel Vlaicu University of Arad
Cheng Siong Chin, Newcastle University in Singapore
Wanyang Dai, Nanjing University
Hanh-Nhi Tran, Institut de Recherche en Informatique de Toulouse
The-Bao Pham, Saigon University
▪Local Organizing Chair
Nora Sharkasi, Tokyo International University
▪Local Organizing Committee
Wenbin Gan, National Institute of Information and Communications Technology
Samuel Amponsah, Tokyo International University
Vasily Lubashevskiy, Tokyo International University
▪Publicity Chairs
Zolzaya Dashdorj, Mongolian University of Science and Technology
Sulayman Sowe, RWTH Aachen University
Rangga Handika, Tokyo International University


*VENUE
----------
Tokyo International Exchange Center, Tokyo, Japan (Pending)
Address: Tokyo Academic Park, 2-2-1 Aomi, Koto-ku, Tokyo 135-8630 Japan


*CONTACT
----------
Dr. Lily Van
amlds_conf@163.com
website: www.amlds.site
最后更新 Lily Van 在 2024-09-16
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相关期刊
CCF全称影响因子出版商ISSN
Complexity1.700Hindawi1076-2787
Journal of Management Information Systems7.700Myron E. Sharpe0742-1222
bJournal of Symbolic Computation0.600Elsevier0747-7171
International Journal of Fuzzy Logic and Intelligent SystemsKorean Institute of Intelligent Systems1598-2645
IEEE Journal on Exploratory Solid-State Computational Devices and Circuits2.000IEEE2329-9231
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cLogical Methods in Computer Science Logical Methods in Computer Science1860-5974
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IEEE Communications Letters3.700IEEE1089-7798
全称影响因子出版商
Complexity1.700Hindawi
Journal of Management Information Systems7.700Myron E. Sharpe
Journal of Symbolic Computation0.600Elsevier
International Journal of Fuzzy Logic and Intelligent SystemsKorean Institute of Intelligent Systems
IEEE Journal on Exploratory Solid-State Computational Devices and Circuits2.000IEEE
Journal of Symbolic Logic Association for Symbolic Logic
Logical Methods in Computer Science Logical Methods in Computer Science
ACM Transactions on Mathematical Software2.700ACM
Networking ScienceSpringer
IEEE Communications Letters3.700IEEE
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