会议信息
EmbeddedCom 2014: International Symposium on Embedded Computing
http://action.dlmu.edu.cn/uscience/embeddedcom2014/截稿日期: |
2014-05-01 Extended |
通知日期: |
2014-06-05 |
会议日期: |
2014-08-24 |
会议地点: |
Dalian, China |
届数: |
12 |
浏览: 12541 关注: 0 参加: 0
征稿
----------------- Important Dates ----------------- Paper submission: April 20, 2014 Notification of Paper Acceptance: June 5, 2014 Camera ready due: June 30, 2014 Conference Registration: June 30, 2014 Conference: August 24-27, 2014 ----------------- Special Issues ----------------- Selected bested papers will be recommended for publication in special issues of several SCI-indexed journals. ---------------------------------------- Paper Submission and Publication ---------------------------------------- All papers need to be submitted electronically through the conference website(http://www.easychair.org/conferences/?conf=embeddedcom2014)with PDF format. The materials presented in the papers should not be published or under submission elsewhere. Submit a full paper with 8 pages plus up to 2 extra pages (IEEE Computer Society Proceedings Manuscripts style: two columns, single-spaced), including figures and references, using 10 fonts, and number each page. You can confirm the IEEE Computer Society Proceedings Author Guidelines at the following web page: http://www.computer.org/portal/web/cscps/formatting. Once accepted, the paper will be included into the IEEE conference proceedings published by IEEE Computer Society Press (indexed by EI). Authors (at least one) of any accepted paper are requested to register at the conference. ============================================= --------------------------------- Introduction --------------------------------- EmbeddedCom 2014 is to bring together computer scientists, industrial engineers, and researchers to discuss and exchange experimental and theoretical results, novel designs, work-in-progress, experience, case studies, and trend-setting ideas in the area of Embedded Computing. EmbeddedCom 2014 will be held in Dalian,China. The objective of EmbeddedCom 2014 is to bring together researchers and practitioners from academia, industry and governments to advance the theories and technologies in parallel and distributed computing.EmbeddedCom 2014 will focus on two broad areas of parallel and distributed computing, i.e. architectures, algorithms and networks, and systems and applications. The conference of EmbeddedCom 2014 will be organized by Dalian Maritime University, China - Department of Computer Science. ------------------- Topics ------------------- Topics of interest include, but are not limited to: Embedded System Architecture Embedded Software Development and Optimization Cyber-Physical Systems Security and Fault Tolerance Embedded Hardware Support Hardware/Software Co-design Real-time Systems Power and Energy-aware Computing Sensor Networks Pervasive Computing & Communications Middleware and Peer-to-Peer Computing Internet Computing and Applications Multimedia and Data Management Human-computer Interaction Mobile Computing Agents and Distributed Computing Application-specific Processors and Devices Industrial Practices and Benchmark Suites Supporting Technologies: SoC, FPGA, etc. Embedded & Ubiquitous Applications Development New challenges for next generation embedded computing systems, arising from new technologies (e.g., nanotechnology), new applications (e.g., ubiquitous computing, embedded internet tools), new principle (e.g., embedded engineering), etc. Embedded and Network Computing System Software for Embedded and Ubiquitous Systems
最后更新 Dou Sun 在 2014-04-20
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相关期刊
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全称 | 影响因子 | 出版商 |
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Ethics and Information Technology | 3.400 | Springer |
Journal of Digital Imaging | 2.900 | Springer |
Interaction Studies | 0.900 | John Benjamins Publishing Company |
BMC Bioinformatics | 2.900 | BioMed Central |
APL Photonics | 5.400 | American Institute of Physics |
Entropy | 2.100 | MDPI |
Advances in Data Analysis and Classification | 1.400 | Springer |
International Journal on Organic Electronics | AIRCC | |
Journal of Classification | 1.800 | Springer |
IEEE Transactions on Haptics | 2.400 | IEEE |
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