会议信息
SLIP 2019: International Workshop on System Level Interconnect Prediction
http://www.sliponline.org/
截稿日期:
2019-03-22
通知日期:
2019-04-07
会议日期:
2019-06-02
会议地点:
Las Vegas, Nevada, USA
届数:
21
浏览: 10430   关注: 0   参加: 0

征稿
Technical topics include but are not limited to:

    Learning and predictive models for optimizing interconnect at various IC and system design stages
    System-level design for FPGAs, NoCs, reconfigurable systems
    Design, analysis, and (co)optimization of power and clock networks
    Topologies and fabrics of multi- and many-core architectures
    Power consumption of interconnects
    System level reliability, aging, and thermal issues
    Security-aware power/clock delivery and interconnect design
    Design-for-manufacturing (DFM) and yield techniques for interconnects
    High speed chip-to-chip interconnect
    Design and analysis of chip-package interfaces
    3D interconnect design and prediction
    Applications of interconnects to social, genetic, and biologicalsystems
    Emerging interconnect technologies in machine learning platforms & chips
最后更新 Dou Sun 在 2019-03-31
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