期刊信息
IEEE Transactions on Mobile Computing (TMC)
https://www.computer.org/csdl/journal/tm
影响因子:
7.700
出版商:
IEEE
ISSN:
1536-1233
浏览:
35185
关注:
85
征稿
IEEE Transactions on Mobile Computing focuses on the key technical issues related to (a) architectures, (b) support services, (c) algorithm/protocol design and analysis, (d) mobile environments, (e) mobile communication systems, (f) applications, and (g) emerging technologies.

Topics of interest include, but are not limited to, the following:

a) Architectures – Mobile networks and hosts, Agents and proxies, Mobility management, mobile agent and proxy architectures, Integrated wireline and wireless systems, Planning and standardization. b) Support Services – Mobility and roaming, Nomadic computing, Multimedia, Operating system support, Power management. c) Algorithm/Protocol Design and Analysis – Online and mobile environments, Limited bandwidth, Intermittent connectivity. d) Mobile Environments – Data and knowledge management, Performance modeling and characterization, Security, scalability and reliability, Design, management and operation, Systems and technologies. e) Mobile Communication Systems – Wireless cellular and spread-spectrum systems, Multi-user and multi-access techniques and algorithms, Multi-channel processing, Channel coding, Data coding and compression. f) Applications – Location-dependent and sensitive, Nomadic computing, Wearable computers and body area networks, Multimedia applications and multimedia signal processing, Pervasive computing, Wireless sensor networks. g) Emerging Technologies.

Cosponsors

TMC is published in cooperation with: IEEE Electromagnetic Compatibility Society, IEEE Engineering in Medicine and Biology Society, IEEE Technology Management Council, IEEE Information Theory Society, IEEE Instrumentation and Measurement Society, IEEE Power & Energy Society, IEEE Robotics and Automation Society, and IEEE Systems, Man, and Cybernetics Society

Additional Information

TMC is indexed in ISI. TMC has a new editor in chief for the 2020-2022 term: Qian Zhang of Hong Kong University of Science and Technology.
最后更新 Dou Sun 在 2024-07-25
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