Basic Information
Name: Hongwei Hu
Institution: Harbin Institute of Technology
Registration: 2015-12-20
Score: 32
Tracked Conferences
CCF | CORE | QUALIS | Short | Full Name | Submission | Notification | Conference |
---|---|---|---|---|---|---|---|
ISIE | International Symposium on Industrial Electronics | 2021-12-01 | 2022-02-15 | 2022-06-01 | |||
b | b1 | CBSE | International ACM SIGSOFT Symposium on Component Based Software Engineering | 2016-01-18 | 2016-02-15 | 2016-04-05 |
Short | Full Name | Submission | Conference |
---|---|---|---|
ISIE | International Symposium on Industrial Electronics | 2021-12-01 | 2022-06-01 |
CBSE | International ACM SIGSOFT Symposium on Component Based Software Engineering | 2016-01-18 | 2016-04-05 |
Attend Conferences
CCF | CORE | QUALIS | Short | Full Name | Conference | Location |
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ISIE | International Symposium on Industrial Electronics | 2016-06-08 | Santa Clara, California, USA |
Full Name | Conference | Location |
---|---|---|
International Symposium on Industrial Electronics | 2016-06-08 | Santa Clara, California, USA |
Tracked Journals
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Followed Researchers
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Tracked Jobs
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Viewed Conferences
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