姓名: Joy Li

科研机构: Multidisciplinary Digital Publishing Institute

注册时间: 2021-09-03

活跃度: 350

I am currently working in Electronics-MDPI as Section Managing Editor. 
E-Mail: joy.li@mdpi.com
Twitter: @Joy65703263 @ElectronicsMDPI
Linkedin: @Electronics MDPI @Joy Li
Electronics (https://www.mdpi.com/journal/electronics)
Electronics indexed within Scopus, SCIE (Web of Science), CAPlus / SciFinder, Inspec, and many other databases.
Impact Factor 2020: 2.397
CiteScore 2020 (Scopus): 2.7
New Journal Awards are Open for Applications:
https://www.mdpi.com/journal/electronics/awards
We look forward to establishing cooperation with scholars from all over the world.

Conference collaboration:
1. MCSoC 2021: International Symposium on Embedded Multicore/Many-core Systems-on-Chip: https://www.mcsoc-forum.org/
2. the World Engineers Summit (WES) 2021: www.wes-ies.org
3. BIA 2021: International Conference on Biomedical Innovations and Applications: http://biaconf.tu-varna.bg/
4. 11th International Conference & Exhibition on Green Flexible & Printed Electronics Industry: http://www.ltfn.gr/conference/
5. 2022 2nd Power System And Green Energy Conference ( PSGEC 2022): https://www.psgec.org/

These special issues are now open for submission. Welcome your valuable contributions and please feel free to contact Joy Li  if you have any inquires about these Special Issues.

1. Recent Advances on Intelligent Multimedia Networks
Website: https://www.mdpi.com/journal/electronics/special_issues/multimedia_networks
Submission Deadline: 31 March 2022.

2. Flexible Devices and Optoelectronics Technologies
Website: https://www.mdpi.com/journal/electronics/special_issues/Flexible_Optoelectron
Submission Deadline: 31 March 2022.

3. Wearable Antennas for 5G, IoT, and Medical Applications
Website: https://www.mdpi.com/journal/electronics/special_issues/wearable_antenna
Submission Deadline: 1 April 2022.

4. Advanced Machine Learning for Intelligent Robotics
Website: https://www.mdpi.com/journal/electronics/special_issues/intell_rob
Submission Deadline: 30 April 2022.

5. AI & IoT Assisted Emerging Cutting-Edge Research Areas for Industry 4.0 & Industry 5.0 Sustainability
Website: https://www.mdpi.com/journal/electronics/special_issues/AI_IoT_Industry
Submission Deadline: 30 April 2022.

6. Circuits and Optoelectronics for Point-of-Care Medical Devices
Website: https://www.mdpi.com/journal/electronics/special_issues/poc_med_devices
Submission Deadline: 22 May 2022.

7. Recent Advances in Microelectronics Devices and Integrated Circuit
Website: https://www.mdpi.com/journal/electronics/special_issues/microelectron_devices_integr_circuits
Submission Deadline: 31 May 2022.

8. Metastructures and Antennas with Enhanced Properties for Modern Microwave and Millimeter-Wave Applications
Website: https://www.mdpi.com/journal/electronics/special_issues/metastructures_antennas
Submission Deadline: 31 May 2022.

9. Design and Validation of Advanced Quantum Computing
Website: https://www.mdpi.com/journal/electronics/special_issues/quantum_comput
Submission Deadline: 30 June 2022.

10. Advanced Control Strategies with Applications to Biomedical and Biological Systems
Website: https://www.mdpi.com/journal/electronics/special_issues/biomed_biol_processes
Submission Deadline: 30 June 2022.

11. Design and Implementation of RF Front-Ends for Next Generation Communication Systems
Website: https://www.mdpi.com/journal/electronics/special_issues/rf_front_end
Submission Deadline: 31 October 2022.

12. Advances on Ceramic Microsystems
Website: https://www.mdpi.com/journal/electronics/special_issues/ceram_microsys
Submission Deadline: 31 December 2022.

13. Computer-Aided Design for Integrated Circuits and Systems
https://www.mdpi.com/journal/electronics/special_issues/CAD_Circuits_System
Submission Deadline: 31 January 2023