Información de la conferencia
ATMME 2018: International Conference on Advanced Technologies in Manufacturing and Materials Engineering
http://www.atmme.org/Día de Entrega: |
2018-03-10 |
Fecha de Notificación: |
2018-03-30 |
Fecha de Conferencia: |
2018-05-04 |
Ubicación: |
Harbin, China |
Años: |
2 |
Vistas: 7586 Seguidores: 0 Asistentes: 0
Solicitud de Artículos
Dear Colleagues, It is our pleasure to invite you to attend the 2nd International Conference on Advanced Technologies in Manufacturing and Materials Engineering (ATMME2018), co-organized by Harbin Institute of Technology (HIT) and Hong Kong Society of Mechanical Engineering (HKSME), technically sponsored by Swinburne University of Technology (SUT) and The Chinese University of Hong Kong (CUHK), which will be held in Harbin, China from May 4 to 6, 2018. The ATMME Conference is an annual event, focusing on the Advanced Technologies in Manufacturing and Materials Engineering as they assess the current state-of-the-art and roadmap crucial areas for future research. The ATMME Conference has become a solid platform for scientists and engineers to share their research findings, exchange ideas, discover novel opportunities, meet with colleagues or acquaint with new friends from abroad, broaden their knowledge and bridge the gap between academia and industry.Papers on various topics are welcome in the field of Advanced Technologies in Manufacturing and Materials Engineering. Following the big success of the first ATMME conference in Bangkok, Thailand in 2017, the second ATMME conference will be held inHarbin, a historical and modern city with distinctive Russian influence. The Harbin city is known for its cool, comfortable summer and the annual Ice Sculpture Festival in January. Cold weather lasts about 190 days each year, but allyear round, you will find people here are warm-hearted and friendly. We believe that thisconference and this city will be an unforgettable experience for you. Looking forward to welcoming you in Harbin! Best regards, Prof. Tao Sun and Prof. Yongda Yan Co-Chairs of the ATMME 2018
Última Actualización Por Dou Sun en 2018-02-05
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Nombre Completo | Factor de Impacto | Editor |
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IEEE Communications Letters | 3.700 | IEEE |
IEEE Control Systems Letters | 2.400 | IEEE |
ACM Transactions on Accessible Computing | 2.500 | ACM |
Annals of Software Engineering | Springer | |
Journal of Symbolic Logic | Association for Symbolic Logic | |
ACM Transactions on Asian and Low-Resource Language Information Processing | 1.800 | ACM |
Journal of the American Society for Information Science and Technology | 2.800 | John Wiley & Sons, Ltd. |
ACM Journal on Emerging Technologies in Computing Systems | 2.100 | ACM |
IET Circuits, Devices & Systems | 1.000 | IET |
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