Including Materials Science Communications

An international, interdisciplinary journal on science, characterisation and processing of advanced materials – The International Journal of the Materials Research Society-Taiwan (MRS-T)

Materials Chemistry and Physics is devoted to short communications, full-length research papers and feature articles on interrelationships among structure, properties, processing and performance of materials. The Editors welcome manuscripts on all subjects of metallurgy, engineering and functional ceramics, specialty polymers, composites, low D materials, surface modification and coatings with emphasis on, but not limited to, energy materials, green materials, optoelectronic materials, electronic, magnetic and semiconductor materials, biomaterials, sustainable materials, degradation and reliability, and modelling of materials.

Keywords: metallurgy, ceramics, polymers, composites, low D materials, nanomaterials, functional materials, high entropy materials, surface, interface, coating, thin film, porous materials, soft materials, energy materials, fuel cell, solar cell, photovoltaic, supercapacitor, battery, electrode materials, green materials, optoelectronic materials, electronic materials, magnetic material, multiferroic materials, electromagnetic materials, semiconductor materials, biomaterial, sustainable materials, materials degradation, corrosion, oxidation, reliability, materials modelling.

Special Issue on High Entropy Materials: Fundamentals and Potential Applications
Submission Date: 2024-11-30

High-Entropy Materials (HEMs) encompass High-Entropy Alloys (HEAs), High-Entropy Ceramics (HECs), High-Entropy Polymers (HEPs), and other multicomponent systems that occupy previously uncharted regions of compositional space. Since Professor Jien-Wei Yeh proposed the concept, the field has become a dynamic and vibrant area of materials science and engineering. Symposia, meetings, and workshops of HEMs are being held in many countries, and a rapid increase in the number of scientific journal publications and citations is evident. A Special Symposium in Honor of Prof. Jien-Wei Yeh is scheduled to take place in Cancun, Mexico, on August 18-23, 2024. This event, part of IMRC-2024, commemorates the 20th anniversary of his groundbreaking contributions to the realm of materials research. The present moment marks a significant juncture for HEMs research, with immense potential applications not only in structural engineering but also across diverse fields such as optoelectronics, magnetism, thermoelectrics, catalysis, energy storage (batteries and solid hydrogen storage), biomedical implants, thermal barrier coatings, and protective coatings against wear and oxidation/corrosion. To showcase the excellent research presented in this special symposium, the journal Materials Chemistry and Physics (MCP) is planning to publish a special issue for this symposium. This issue also welcomes submissions from all other researchers in the field of high-entropy materials. The scope of the special issue includes (but is not limited to):

    High-Entropy Alloys
    High-Entropy Ceramics
    High-Entropy Polymers
    Structural Properties
    Functional Properties
    Environmental Resistance
    Materials Synthesis and Processing
    Advanced Microstructural Characterization
    Modeling, Simulation and AI-based Approaches
    Potential Applications

Guest editors:

​Executive Guest Editor

Professor An-Chou Yeh
Organization*: Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan
Institutional Email Address*: yehac@mx.nthu.edu.tw
Areas of Expertise*: High Entropy Alloys; Superalloys; Alloy Design; Microstructure Engineering; Additive Manufacturing

Co-Guest Editors

Professor Oleg Senkov
Organization*: Materials and Manufacturing Directorate, Air Force Research Laboratory, Wright-Patterson AFB, Ohio, USA
Institutional Email Address*: oleg.senkov.ctr@us.af.mil
Areas of Expertise*: Microstructure, Mechanical Properties, Materials Processing, Advanced Materials, Mechanical Testing, Mechanical Behavior of Materials, Material Characterization, Materials, Nanomaterials, Material Characteristics

Professor Martin Heilmaier
Organization*: Department of Materials Science and Engineering, Institute for Applied Materials, Karlsruhe Institute of Technology, Karlsruhe, Germany
Institutional Email Address*: martin.heilmaier@kit.edu
Areas of Expertise*: Mechanical Behavior of Materials, Microstructure, Advanced Materials, Materials Processing, Mechanical Properties, Material Characterization, Materials, Mechanical Testing, Material Characteristics, X-ray Diffraction

Professor Stéphane Gorsse
Organization*: University of Bordeaux, Institute of Condensed Matter Chemistry of Bordeaux, Pessac, France
Institutional Email Address*: stephane.gorsse@icmcb.cnrs.fr
Areas of Expertise*: Metallurgy; Microstructure; Computational Thermodynamic; Data Science; High Entropy Alloys; Metal Additive Manufacturing

Professor José Martin Herrera-Ramirez
Organization*: Centro de Investigación en Materiales Avanzados (CIMAV), Laboratorio Nacional de Nanotecnología,Chihuahua, México
Institutional Email Address*: martin.herrera@cimav.edu.mx
Areas of Expertise*: High-entropy alloys; Composite materials; Microstructure; Mechanical properties

Manuscript submission information:

Submission Deadline: 30-Nov-2024

To submit your manuscript please go to the Journal of Materials Chemistry and Physics (at https://www.sciencedirect.com/journal/materials-chemistry-and-physics ) and follow the procedures for manuscript submission. When prompted for 'Enter Manuscript Information' you can select our Special Issue Article type as ‘VSI: High Entropy Materials” at https://www.editorialmanager.com/matchemphys/default2.aspx.

Author Guidelines can be found at: https://www.elsevier.com/journals/
materials-chemistry-and-physics/0254-0584/guide-for-authors.

Keywords:

    High-Entropy Alloys; 
    High-Entropy Ceramics; 
    High-Entropy Polymers; 
    Structural Properties; 
    Functional Properties; 
    Environmental Resistance; 
    Processing; 
    Characterization; 
    Data Science