会议信息
TENCON 2024: IEEE Region Ten Conference
https://tencon2024.org/
截稿日期:
2024-05-30
通知日期:
2024-08-01
会议日期:
2024-12-01
会议地点:
Singapore
届数:
6
浏览: 25264   关注: 0   参加: 1

征稿
TENCON is a premier international technical conference of IEEE Region 10, which comprises 60 Sections, 6 Councils and 42 Subsections in the Asia Pacific regions.

The theme for TENCON 2024 is Artificial Intelligence and Deep Learning Technologies for a Sustainable Future and it will be held in Singapore over December 1 – 4, 2024.

This conference is expected to bring together researchers, educators, students, practitioners, technocrats and policymakers from across academia, government, industry and non-governmental organizations to discuss, share and promote current works and recent accomplishments across all aspects of electrical, electronics and computer engineering, and information technology. Distinguished speakers will be invited to deliver keynote speeches and invited talks on trends and significant advances in the emerging technologies.
最后更新 Dou Sun 在 2024-03-24
相关会议
CCFCOREQUALIS简称全称截稿日期通知日期会议日期
HotWebIEEE Workshop on Hot Topics in Web Systems and Technologies2016-06-152016-08-312016-10-24
SEASInternational Conference on Software Engineering and Applications2023-09-092023-09-192023-09-23
ICSTTEInternational Conference on SmartRail, Traffic and Transportation Engineering2024-08-202024-09-202024-10-25
Petri NetsInternational Conference on Application and Theory of Petri Nets and Concurrency2019-01-162019-03-082019-06-23
IPPRInternational Conference on Image Processing and Pattern Recognition2024-06-222024-06-152022-08-20
ICETInternational Conference on Emerging Technologies2018-08-152018-09-152018-11-21
CSSInternational Symposium on Cyberspace Safety and Security2022-03-012022-07-302022-10-16
RFICRadio Frequency Integrated Circuits Symposium2024-01-09 2024-06-16
ICCSIInternational Conference on Computer Systems and Informatics2015-09-302015-11-152016-05-03
cbb1ICWEInternational Conference on Web Engineering2024-01-262024-03-222024-06-17
相关期刊
推荐