期刊信息
Materials Letters
https://www.sciencedirect.com/journal/materials-letters影响因子: |
2.700 |
出版商: |
Elsevier |
ISSN: |
0167-577X |
浏览: |
18730 |
关注: |
0 |
征稿
Aims & Scope Materials Letters is an interdisciplinary journal devoted to rapid communications on the science, applications, and processing of materials. Materials Letters is dedicated to publishing novel, cutting edge reports of broad interest to the materials community. The journal provides a forum for materials scientists and engineers, physicists, and chemists to rapidly communicate on the most important topics in the field of materials. Contributions include, but are not limited to, a variety of topics such as: Materials - Metals and alloys, amorphous solids, ceramics, composites, polymers, semiconductors, biomaterials and biological materials, advanced materials, metamaterials, high-entropy alloys, nitrides, and oxides. Applications - Structural, opto-electronic, magnetic, biomedical, MEMS, sensors, electronics, smart materials, additive manufacturing, membranes, materials for energy systems, batteries, photocatalysis. Characterization - Analytical, microscopy, scanning probes, nanoscopic, optical, electrical, magnetic, acoustic, spectroscopic, diffraction. Novel Materials - Micro and nanostructures (nanowires, nanotubes, nanoparticles), nanocomposites, thin films, superlattices, quantum dots. Processing - Crystal growth, thin film processing, sol-gel processing, solvo-hydrothermal processing, mechanical processing, assembly, nanocrystalline processing, sustainable/green processing routes. Properties - Mechanical, magnetic, optical, electrical, ferroelectric/piezoelectric, thermal, interfacial, transport, thermodynamic, photoelectrochemical, photocatalytic, thermoelectric, biological, electrochemical. Synthesis - Quenching, solid state, mechano-chemical, solidification, solution synthesis, vapor deposition, high pressure, explosive, MOVPE and LPE epitaxial processes, single crystal growth. Machine Learning/Artificial Intelligence - Materials discovery, design of materials and digital materials science.
最后更新 Dou Sun 在 2024-08-11
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全称 | 影响因子 | 出版商 |
---|---|---|
International Journal of Wireless Information Networks | 1.500 | Springer |
Numerical Heat Transfer, Part B: Fundamentals | 1.700 | Taylor & Francis |
Journal of Information Technology Education: Research | Informing Science Institute | |
Optics & Laser Technology | 4.600 | Elsevier |
Procedia Manufacturing | Elsevier | |
Signal Processing: Image Communication | 3.400 | Elsevier |
Computer Modeling in Engineering & Sciences | 2.200 | Tech Science Press |
Computers & Fluids | 2.500 | Elsevier |
IEEE Transactions on Industrial Cyber-Physical Systems | IEEE | |
Materials Letters | 2.700 | Elsevier |
相关会议
简称 | 全称 | 截稿日期 | 会议日期 |
---|---|---|---|
ICGEA | International Conference on Green Energy and Applications | 2022-01-30 | 2022-03-04 |
CEEPE | International Conference on Energy, Electrical and Power Engineering | 2024-02-20 | 2024-04-26 |
ICMHI | International Conference on Medical and Health Informatics | 2024-03-15 | 2025-05-16 |
CSEA' | International Conference on Computer Science, Engineering and Applications | 2023-11-04 | 2021-11-27 |
ICIAI | International Conference on Innovation in Artificial Intelligence | 2025-02-05 | 2025-03-13 |
INFUS | International Conference on Intelligent and Fuzzy Systems | 2018-12-15 | 2019-07-23 |
ICSMM | International Conference on Sensors, Materials and Manufacturing | 2021-07-05 | 2021-11-19 |
PReMI | International Conference on Pattern Recognition and Machine Intelligence | 2023-05-10 | 2023-12-12 |
ICNCSS | International Conference on New Computational Social Science | 2020-07-28 | 2020-09-25 |
ICFL | International Conference on Future Learning | 2020-11-10 | 2020-12-17 |
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