会议信息
ICCEA 2023: International Conference on Civil Engineering and Architecture
http://www.iccea.org/截稿日期: |
2023-10-30 Extended |
通知日期: |
2023-11-15 |
会议日期: |
2023-12-16 |
会议地点: |
Bali, Indonesia |
届数: |
6 |
浏览: 2740 关注: 0 参加: 0
征稿
2023 6th International Conference on Civil Engineering and Architecture (ICCEA 2023) is the premier forum for the presentation of new advances and research results in the fields of theoretical, experimental, and practical civil engineering and architecture. The conference will bring together leading researchers, engineers and architects in the domain of interest from around the world. Topics of interest for submission include, but are not limited to: * Adhesives * Architectural Design and Planning * Architectural Theories * Architectural History * Block material * Building Energy Conservation and Green Architecture * Bridge and Tunnel Engineering * Ceramics and Glasses * Composites * Cement and cement based composites * Concrete technology * Coatings and paints * Construction and Renewable Energy Sources * Computers in Architecture * Civil Engineering and Materials * Clean Technology Initiatives and Successes * Developments and Innovations in Architecture * Engineering Polymers and Plastics * Environment and Technology * Educational Topics in Civil Engineering and Architecture * Engineering Structure Safety and Disaster Prevention * Energy Conservation * Environmental Engineering and Environmental Protection * Engineering Management * Environmental Management Systems (EMSs) * Environmental and Water Resources Planning and Management * Flame retardant materials * Geotechnical Engineering * Geological Engineering * Geographic Information Systems (GISs) * High-rise Buildings and Large-span Structures * Heating, Gas Supply, Ventilation and Air Conditioning Works * Hydraulic and Hydro-Power Engineering * Insulation materials * Individual Buildings and Building Types * Innovative Technology, Method and Technique in Civil Engineering * Newer Structures and Special Structures * Multifunctional Materials * Metals and Alloys * Municipal Engineering * Mitigation of Water Resources * Project and Construction Processes * Reuse and Recycle of Wastewater * Road and Railway Engineering * Smart Materials * Superplastic Materials * Sustainable Architecture * Structural Reliability, Durability and Health Monitoring * Sustainable Development of Building Energy and Environment * Thin Film Chalcogenide Photovoltaic Materials * Theoretical and Advanced Technology of Engineering Structures * Transportation Engineering * Traffic Engineering * Town Planning * Urban Regeneration and Sustainable Development * Waterproof materials * Water and Wastewater Treatment * Wood, bamboo and stone
最后更新 Dunn Carl 在 2023-10-12
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相关期刊
CCF | 全称 | 影响因子 | 出版商 | ISSN |
---|---|---|---|---|
Visualization in Engineering | Springer | 2213-7459 | ||
Telecommunication Systems | 1.700 | Springer | 1018-4864 | |
c | Expert Systems with Applications | 7.500 | Elsevier | 0957-4174 |
Electronic Journal of e-Learning | Academic Publishing Limited | 1479-4403 | ||
c | Logical Methods in Computer Science | Logical Methods in Computer Science | 1860-5974 | |
Journal of Chemical Theory and Computation | 5.700 | American Chemical Society | 1549-9618 | |
International Journal of Information Security | 2.400 | Springer | 1615-5262 | |
IEEE Journal on Exploratory Solid-State Computational Devices and Circuits | 2.000 | IEEE | 2329-9231 | |
Industrial Robot | 1.900 | Emerald | 0143-991X | |
Molecular Simulation | 1.900 | Taylor & Francis | 0892-7022 |
全称 | 影响因子 | 出版商 |
---|---|---|
Visualization in Engineering | Springer | |
Telecommunication Systems | 1.700 | Springer |
Expert Systems with Applications | 7.500 | Elsevier |
Electronic Journal of e-Learning | Academic Publishing Limited | |
Logical Methods in Computer Science | Logical Methods in Computer Science | |
Journal of Chemical Theory and Computation | 5.700 | American Chemical Society |
International Journal of Information Security | 2.400 | Springer |
IEEE Journal on Exploratory Solid-State Computational Devices and Circuits | 2.000 | IEEE |
Industrial Robot | 1.900 | Emerald |
Molecular Simulation | 1.900 | Taylor & Francis |
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