会议信息
NordPac 2024: IMAPS Nordic Microelectronics Packaging Conference and Exhibition
https://nordic.imapseurope.org/nordpac/
截稿日期:
2024-01-31
通知日期:
2024-06-01
会议日期:
2024-06-11
会议地点:
Tampere, Finland
届数:
8
浏览: 1495   关注: 0   参加: 0

征稿
Topics

Proposed topics of microelectronics and packaging include:

Optoelectronics 	
Harsh environment Applications
Advanced Packaging 	
Electronics Reliability & Quality
Materials & Processes 	
Medical electronics
Power electronics 	
Wearable electronics
Green Technologies 	
Printed electronics
Advanced packaging for MEMS & sensors & sensor systems
最后更新 Dou Sun 在 2023-12-04
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相关期刊
CCF全称影响因子出版商ISSN
Journal of Advanced Manufacturing SystemsWorld Scientific0219-6867
Journal of Computational BiologyMary Ann Liebert1066-5277
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bIET Software1.500IET1751-8806
Multibody System Dynamics2.600Springer1384-5640
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