会议信息
NordPac 2024: IMAPS Nordic Microelectronics Packaging Conference and Exhibition
https://nordic.imapseurope.org/nordpac/截稿日期: |
2024-01-31 |
通知日期: |
2024-06-01 |
会议日期: |
2024-06-11 |
会议地点: |
Tampere, Finland |
届数: |
8 |
浏览: 1495 关注: 0 参加: 0
征稿
Topics Proposed topics of microelectronics and packaging include: Optoelectronics Harsh environment Applications Advanced Packaging Electronics Reliability & Quality Materials & Processes Medical electronics Power electronics Wearable electronics Green Technologies Printed electronics Advanced packaging for MEMS & sensors & sensor systems
最后更新 Dou Sun 在 2023-12-04
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相关期刊
CCF | 全称 | 影响因子 | 出版商 | ISSN |
---|---|---|---|---|
Journal of Advanced Manufacturing Systems | World Scientific | 0219-6867 | ||
Journal of Computational Biology | Mary Ann Liebert | 1066-5277 | ||
Brain Sciences | 2.700 | MDPI | 2076-3425 | |
b | IET Software | 1.500 | IET | 1751-8806 |
Multibody System Dynamics | 2.600 | Springer | 1384-5640 | |
ACM Transactions on Accessible Computing | 2.500 | ACM | 1936-7228 | |
b | ACM Transactions on Design Automation of Electronic Systems | 2.200 | ACM | 1084-4309 |
Optical Materials | 3.800 | Elsevier | 0925-3467 | |
IEEE Journal of Selected Topics in Signal Processing | 8.700 | IEEE | 1932-4553 | |
c | Engineering Applications of Artificial Intelligence | 7.500 | Elsevier | 0952-1976 |
全称 | 影响因子 | 出版商 |
---|---|---|
Journal of Advanced Manufacturing Systems | World Scientific | |
Journal of Computational Biology | Mary Ann Liebert | |
Brain Sciences | 2.700 | MDPI |
IET Software | 1.500 | IET |
Multibody System Dynamics | 2.600 | Springer |
ACM Transactions on Accessible Computing | 2.500 | ACM |
ACM Transactions on Design Automation of Electronic Systems | 2.200 | ACM |
Optical Materials | 3.800 | Elsevier |
IEEE Journal of Selected Topics in Signal Processing | 8.700 | IEEE |
Engineering Applications of Artificial Intelligence | 7.500 | Elsevier |
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