Información de la conferencia
DSD 2021: Euromicro Conference on Digital System Design
https://dsd-seaa2021.unipv.it/dsd/index.htmlDía de Entrega: |
2021-05-05 Extended |
Fecha de Notificación: |
2021-06-05 |
Fecha de Conferencia: |
2021-09-01 |
Ubicación: |
Palermo, Italy |
Años: |
24 |
QUALIS: b1 Vistas: 18045 Seguidores: 0 Asistentes: 0
Solicitud de Artículos
Scope The Euromicro Conference on Digital System Design (DSD) addresses all aspects of (embedded, pervasive and high-performance) digital and mixed HW/SW system engineering, covering the whole design trajectory from specification down to micro-architectures, digital circuits and VLSI implementations. It is a forum for researchers and engineers from academia and industry working on advanced investigations, developments and applications. It focuses on today’s and future challenges of advanced embedded, high-performance and cyber-physical applications; system and processor architectures for embedded and high-performance HW/SW systems; design methodology and design automation for all design levels of embedded, high-performance and cyber-physical systems; modern implementation technologies from full custom in nanometer technology nodes, through FPGAs, to MPSoC infrastructures. Authors are kindly invited to submit their work according (but not limited) to the main topics of the conference main track. In addition, several Special Sessions (with their own coordinators and subprogram committees) do also welcome contributions in specific themes of particular interest. All papers are reviewed following guidelines, quality requirements and thresholds that are common to all committees. Extended versions of selected best papers will be published in a special issue of the ISI indexed Euromicro/Elsevier journal “Microprocessors and Microsystems: Embedded Hardware Design” (MICPRO) having the 2018 Impact Factor as high as 1.045. Main Topics Design and synthesis of systems, hardware and embedded software IoT, cyber-physical and embedded systems Systems-on-a-chip, networks-on-a-chip and systems-in-a-package Autonomous, self-aware, re-configurable and adaptable systems, and their design Reliable, Secure, Safe and Optimized to multiple objectives systems, and their design Formal Methods in System Design Specification, modeling, analysis, validation and test for systems, hardware and embedded software Design automation at system, register-transfer, logic and physical levels Advanced applications of cyber-physical, embedded and high-performance systems Application analysis and parallelization for embedded and high-performance design New issues introduced by emerging applications and technologies, and their solutions
Última Actualización Por Dou Sun en 2021-04-30
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Nombre Completo | Factor de Impacto | Editor |
---|---|---|
International Journal of Pattern Recognition and Artificial Intelligence | 0.900 | World Scientific |
Information Polity | 1.300 | IOS Press |
Journal of Trust Management | Springer | |
Journal of Construction Engineering | Hindawi | |
International Journal of Wireless Information Networks | 1.500 | Springer |
International Journal of Computer Science and engineering Survey | AIRCC | |
The Scientific World Journal | Hindawi | |
Neural Computing and Applications | 4.500 | Springer |
Archival Science | 1.400 | Springer |
International Journal of Data Mining & Knowledge Management Process | AIRCC |
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